Printed circuit board with embedded electronic component and manufacturing method thereof
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United States of America Patent
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Jun 12, 2018
Issued Date -
Jul 28, 2016
app pub date -
Jan 8, 2016
filing date -
Jan 23, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board including an electronic component and a method of producing the same are provided. The printed circuit board includes a multilayered substrate including an insulation layer and an inner circuit layer laminated therein, a cavity disposed in the multilayered substrate, a via disposed in the insulation layer and configured to electrically connect the inner circuit layer with another inner circuit layer, a first electronic component inserted in the cavity, and a bump pad disposed on a surface of the cavity facing the first electronic component, and the bump pad is formed by having the insulation layer and the via exposed to a lateral side of the cavity.
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