Electronic package
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United States of America Patent
Stats
-
Jun 12, 2018
Issued Date -
Aug 10, 2017
app pub date -
May 24, 2016
filing date -
Feb 4, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.
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