Self-decap cavity fabrication process and structure

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United States of America Patent

PATENT NO 9999134
APP PUB NO 20170265298A1
SERIAL NO

15081623

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Abstract

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A PCB having multiple stacked layers laminated together. The laminated stack includes regular flow prepreg and includes a recessed cavity, a bottom perimeter of which is formed by a photo definable, or photo imageable, polymer structure, such as a solder mask frame, and a protective film. The solder mask frame and protective film protect inner core circuitry at the bottom of the cavity during the fabrication process, as well as enable the use of regular flow prepreg in the laminated stack.

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Patent Owner(s)

Patent OwnerAddress
FLEX LTDSINGAPORE 486123

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pen, Kwan Guangdong, CN 4 35
Yu, Pui Yin Tsuen Wan, HK 15 53
Zhang, Mark Guangdong, CN 30 181

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