Method for forming vias on printed circuit boards

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United States of America Patent

PATENT NO 9999137
APP PUB NO 20160128201A1
SERIAL NO

14931356

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Abstract

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A method for filling a via on a printed circuit board formulates a paste as a dispersion of copper particulate that includes nanocopper particles in a solvent and a binder and depositing the paste into a via cavity formed in the printed circuit board. Heating the paste-filled cavity removes most of the solvent. The method sinters the deposited paste in the via cavity, planarizes the sintered via, and overplates the filled via with copper.

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Patent Owner(s)

Patent OwnerAddress
NCC NANO LLC12221 MERIT DRIVE THREE FOREST PLAZA SUITE DALLAS TX 75251

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ciufo, David Hilton, US 1 10
Heyen, Janet Rochester, US 4 33

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