Electronics housing and manufacturing method of electronics housing

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United States of America Patent

PATENT NO 9999148
SERIAL NO

15620828

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An electronics housing includes a base body and a metal plating layer formed on a surface of the base body. The base body includes an upper cover, a lower cover and a metal ring. The upper cover and the lower cover are integrally fused by virtue of an ultra high frequency technology, and the metal ring is embedded between the upper cover and the lower cover. A nickel-deposited layer of the metal plating layer is electrolessly deposited on the surface of the base body. A copper layer of the metal plating layer is plated on the nickel-deposited layer. A nano-nickel layer of the metal plating layer is plated on the copper layer. A surface decoration layer of the metal plating layer is plated on the nano-nickel layer. The base body together with the metal plating layer defines at least one assembling hole.

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Patent Owner(s)

  • CHENG UEI PRECISION INDUSTRY CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, James New Taipei, TW 320 10852

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