Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

China Patent

PATENT NO 101434894
APP PUB NO CN-101434894-A
SERIAL NO

200810178886

Stats

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A semiconductor wafer cleaning formulation, including l-35% wt. fluoride source, 20-60% wt. organic amines, 0.1-40%wt. nitrogenous component, e.g., a nitrogen-containing carboxylic acid or an imine, 20-50%wt. water, and 0-21% wt. metal chelating agents. The formulations are useful to remove residue from wafers following a resist plasma ashing step, such as inorganic residue from semiconductor wafers containing delicate copper interconnecting structures.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
ADVANCED TECHNOLOGY MATERIALS INCUSDANBURY CT 06810-4169

International Classification(s)

Inventor(s)

Inventor Name Address
WOJTCZAK WILLIAM A -
BERNHARD DAVID -
SEIJO MA FATIMA -
LONG ·RUAN -

Cited Art Landscape

Load Citation