Pure copper material, insulating substrate and electronic device

China Patent

APP PUB NO CN-118742659-A
SERIAL NO

202380023423

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Abstract

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In the pure copper material, the average crystal grain diameter in the rolled surface is 10 [ mu ] m or more in the range of 99.9 mass% or more and 99.999 mass% or less, the measurement area of 1mm 2 or more is measured by the EBSD method in a step of 1 [ mu ] m measurement interval, and the average value of LOS (Local Orientation Spread: local orientation distribution) when the boundary of the orientation difference between adjacent pixels of 5 DEG or more is regarded as a grain boundary is 2.00 DEG or less excluding the measurement point of the CI value of 0.1 or less which is analyzed by the data analysis software OIM.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI MATERIALS CORPNot Provided

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Inventor(s)

Inventor Name Address
MAKI KAZUNARI -
ITO YUKI -
KAWASAKI KENICHIRO -
OHIRA TAKUMI -

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