METHOD OF MANUFACTURING ASILICON WAFER AND A SILICON EPITAXIAL WAFER

European Patent Office Patent

PATENT NO 1326270
APP PUB NO EP-1326270-A1
SERIAL NO

01965659

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Patent Owner(s)

Patent OwnerAddress
SHIN-ETSU HANDOTAI CO LTDJPTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address
TAKENO HIROSHI TOKYO JAPAN TOKYO METROPOLIS
QU W F ANNAKA-SHI GUNMA 379-0196
HAYAMIZU Y ANNAKA-SHI GUNMA 379-0196

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