Adhesion promotion of metal to laminate with a multi-functional compound

European Patent Office Patent

APP PUB NO EP-2546387-A1
SERIAL NO

12187699

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Abstract

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An adhesion promotion composition and method for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The adhesion promotion composition comprises a multi-functional compound comprising a first functional group and a second functional group, wherein the first functional group is an aromatic heterocyclic compound comprising nitrogen and the second functional group is selected from the group consisting of vinyl ether, amide, thiamide, amine, carboxylic acid, ester, alcohol, silane, alkoxy silane, and combinations thereof.

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Patent Owner(s)

Patent OwnerAddress
ENTHONEUS

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Inventor(s)

Inventor Name Address
ABYS JOSEPH A BRIDGEWATER NJ
WALCH ERIC 40764 LANGENFELD
SUN SHENLIANG WEST HAVEN CT 06516
OWEI ABAYOMI I 91730 RANCHO CUCAMONGA
ANTONELLIS THEODORE WEST HAVEN CONNECTICUT 06516
RASMUSSEN HANNA 51399 BURSCHEID

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