High density probe head for chip testing

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO H000663
SERIAL NO

07143511

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A probe head of substantially rectangular construction for use in the testing of chips. The probe head has a body disposed about the perimeter of a substantially transparent fused silica window, probe points extending in a high-density fixed configuration through the fused silica window, and probe leads at one end of which the probe points are formed. The probe leads are disposed in a plurality of layers, such that interior surface, as well as perimeter, probing and testing of chips is facilitated. The probe head also includes a depth-limit plate extending over the edge of the fused silica window and connecting to the probe head body.

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Patent Owner(s)

  • CRAY INC.;CRAY RESEARCH, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Massopust, Dan Rte. 3, Box 544, Menomonie, US 3 60

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