Non-metallic chassis structure with electromagnetic field attenuating capability
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United States of America Statutory Invention Reg
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Sep 6, 1988
Grant Date -
N/A
app pub date -
Oct 19, 1987
filing date -
Feb 26, 1985
priority date (Note) -
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Abstract
An electronic equipment chassis structure using non-metallic plastic material such as epoxy-impregnated fiberglass together with layers of shielding metal film, preferably of copper overlaid by nickel. Desirable radio frequency shielding is achieved in comparison with the metal chassis structures and in the presence of decreased chassis mass, lower fabrication cost and chassis change enabling flexibility. Examples of material characteristics, representative fabrication costs, and attained radio frequency attenuation properties are included.
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