Minimal capture pads applied to ceramic vias in ceramic substrates
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United States of America Patent
Stats
-
Jun 29, 1999
Issued Date -
N/A
app pub date -
May 25, 1995
filing date -
Dec 14, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A device includes a ceramic substrate. A ceramic via is defined within the ceramic substrate at an actual location which differs from a designed desired location for the ceramic via. A minimal capture pad electrically communicates the actual location with the designed desired location. The minimal capture pad contains a ceramic via contact portion, a thin film stud contact portion, and a connecting portion; and each of the three is configured to be as small as permitted to limit the capacitances produced by the capture pad.
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