Chemical mechanical polishing method

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United States of America Patent

PATENT NO 11673223
APP PUB NO 20220219285A1
SERIAL NO

17711724

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Abstract

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A chemical mechanical polishing method is provided, including polishing a batch of wafers in sequence on a polishing surface of a polishing pad; conditioning the polishing surface with a pad conditioner, wherein the pad conditioner is operable to apply downward force according to a predetermined downward force stored in a controller to condition the polishing surface; measuring the downward force applied by the pad conditioner with a measurement tool when the pad conditioner is at a home position and after conditioning the polishing surface; comparing the downward force measured by the measurement tool and the predetermined downward force with the controller to determine whether a difference between the downward force measured by the measurement tool and the predetermined downward force exceeds a range of acceptable values; and calibrating the downward force applied by the pad conditioner with the controller when the difference exceeds the range of acceptable values.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Chun-Chieh Hsinchu, TW 34 133
Lai, Jen-Chieh Tainan, TW 12 20
Lin, Shih-Ho Zhubei, TW 30 82
Su, Jheng-Si Zhubei, TW 7 14
Wei, Yu-Chen New Taipei, TW 17 31

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