Automatic analysis and control system for electroless composite plating solution
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United States of America Patent
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Mar 24, 2009
Grant Date -
Apr 13, 2006
app pub date -
Nov 28, 2005
filing date -
May 22, 2000
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An automatic analysis and control system for electroless composite plating solution for automatically analyzing an electroless composite plating solution and performing such a control as to obtain an appropriate bath composition and/or use conditions, wherein, as a technique for measuring the concentration of a metallic component in the plating solution by absorptiometry, the system includes a mechanism for measuring transmissivity or absorbance at least two or more different wavelengths after the plating solution is automatically introduced into an analytical cell, and a mechanism for calculating the objective concentration from the measured values and displaying the calculation results.
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