High density interconnects
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United States of America Patent
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Jul 20, 2004
Grant Date -
Mar 11, 2004
app pub date -
Jan 3, 2002
filing date -
Jan 3, 2002
priority date (Note) -
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Abstract
A method of forming an electrical interconnection between a first electrical device and a second electrical device comprises the steps of providing contacts in an uncompressed state. The uncompressed contacts are then deformed to a compressed state and then the contacts are positioned in a device adapted to hold the contacts between the first and second electrical devices. Or alternatively, the uncompressed contacts are positioned in the device and then compressed to the compressed state. The contacts are then activated to substantially expand to the uncompressed state wherein each contact expands to substantially its uncompressed state for establishing the electrical interconnection between the first and second electrical devices.
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