Semiconductor device
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United States of America Patent
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Apr 27, 2004
Issued Date -
N/A
app pub date -
Mar 7, 2002
filing date -
Mar 8, 2001
priority date (Note) -
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Abstract
In a semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising, at least two semiconductor electric chips, and a substrate on which the semiconductor electric chips are mounted and to which the semiconductor electric chips are electrically connected, in such a manner that the semiconductor electric chips are mounted on and electrically connected to the board through the substrate, according to the present invention, a thickness of each of the semiconductor electric chips in a direction in which the each of the semiconductor electric chips and the substrate are stacked is smaller than a thickness of the substrate in the direction.
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