Semiconductor device, semiconductor device package, and manufacturing methods thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11677211
APP PUB NO 20210021097A1
SERIAL NO

17063140

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.

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First Claim

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Patent Owner(s)

  • NICHIA CORPORATION; SHINIKO ELECTRIC INDUSTRIES CO., LTD.

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hashimoto, Takuya Tokushima, JP 72 249
Kobayashi, Suguru Nagano, JP 14 32
Matsushita, Shigeru Nagano, JP 13 59
Nakazawa, Katsuya Nagano, JP 8 26
Okahisa, Eiichiro Tokushima, JP 40 174
Uehara, Sumio Nagano, JP 11 46
Yumoto, Kazuhito Nagano, JP 5 307

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