Conformal integrated circuit (IC) device package lid

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11158562
SERIAL NO

16787241

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Importance

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Abstract

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An integrated circuit (IC) device package includes an IC device connected to an upper surface of the IC device carrier. Due to operation conditions or IC device package makeup, the IC device may warp. The warped IC device may include a convex upper surface. A conformable lid is connected to the IC device and includes an internal chamber and a deformable floor. The deformable floor is able to deform or bend along with the IC device. After deformation, the deformable floor may include a concave lower surface. A uniform bond line thickness of a thermal interface material that connects the IC device and the conformable lid is able to be achieved due to the deformable floor deforming or bending along with the IC device.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINE CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bunt, Jay A Esopus, US 14 23
Iruvanti, Sushumna Wappingers Falls, US 64 1252
Lewison, David J LaGrangeville, US 9 13
Zhang, Hongqing Hopewell Junction, US 12 19
Zitz, Jeffrey A Poughkeepsie, US 53 603

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