Epoxy resin composition
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United States of America Patent
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Aug 14, 1990
Issued Date -
N/A
app pub date -
Feb 21, 1989
filing date -
May 7, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Storage-stable, thermally-curable, one-part epoxy resin compositions comprising a curable epoxide resin; a curative amount of an aliphatic or non-aromatic cyclic polyol having about 2 to 18 carbon atoms, at least two hydroxy groups of said polyol being primary or secondary, and said polyol being free of strong acid groups, and free of electron-withdrawing substituents and large groups which cause steric hindrance in the .alpha.-position in relation to the carbon atoms attached to the methylol groups of the polyol; and a catalytic amount of an imidazole compound.
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