Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11374148
APP PUB NO 20200395520A1
SERIAL NO

16748689

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Abstract

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The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be μLEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.

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Patent Owner(s)

  • FACEBOOK TECHNOLOGIES, LLC

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abad, Oscar Torrents Cork, IE 12 9
Brodoceanu, Daniel Cork, IE 46 44
Chio, Zheng Sung Cork, IE 19 14
Farrens, Sharon Nanette Cork, IE 3 1
Nguty, Tennyson Newcastle, GB 9 5
Sengul, Ali Zurich, CH 6 3
Wu, Jeb Redmond, US 23 141

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