Composite wafer including a molded wafer and a second wafer

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United States of America Patent

PATENT NO 8822275
APP PUB NO 20130286614A1
SERIAL NO

13459924

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Abstract

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A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.

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Patent Owner(s)

  • HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mathai, Sagi Varghese Berkeley, US 79 684
Panotopoulos, Georgios Berkeley, US 27 774
Patra, Susant K Brentwood, US 14 52
Rosenberg, Paul Kessler Sunnyvale, US 98 539
Sorin, Wayne Victor Mountain View, US 58 501
Tan, Michael Renne Ty Menlo Park, US 182 935

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