Laser micromachining method
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United States of America Patent
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Jan 30, 2007
Issued Date -
N/A
app pub date -
Nov 3, 2004
filing date -
Nov 3, 2004
priority date (Note) -
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Abstract
A method is described for laser scribing or dicing portions of a workpiece using multi-source laser systems. In one embodiment, a first laser uses multiphoton absorption to lower the ablation threshold of portions of the workpiece prior to a second laser ablating the portions of the workpiece. In an alternative embodiment, a first laser uses high energy single-photon absorption to lower the ablation threshold of portions of the workpiece prior to a second laser ablating the portions of the workpiece.
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