Method and apparatus for conditioning a polishing pad with sonic energy
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United States of America Patent
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Apr 29, 2003
Grant Date -
Jul 4, 2002
app pub date -
Jan 4, 2001
filing date -
Jan 4, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus for conditioning a polishing pad is described, wherein the polishing pad has a polishing surface for polishing the semiconductor wafer, and a back surface opposed to the polishing surface. The method includes positioning a sonic energy generator adjacent to the back surface of the polishing pad, and generating sonic energy through the back surface of the polishing pad. The apparatus includes a sonic energy generator adapted to be positioned adjacent the back surface, the sonic energy generator including a transducer connected to a contact member, wherein the sonic energy generator is adapted to transmit sonic energy in a direction through the back surface and to the polishing surface of the polishing belt.
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