Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

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United States of America Patent

PATENT NO 11466123
SERIAL NO

17621926

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Abstract

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The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain; a compound (B) containing one or more carboxy groups; and a photo initiator (C).

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Patent Owner(s)

  • MITSUBISHI GAS CHEMICAL COMPANY INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Katagiri, Shunsuke Tokyo, JP 6 0
Kumazawa, Yune Tokyo, JP 8 0
Shika, Seiji Tokyo, JP 11 28
Suzuki, Takuya Tokyo, JP 135 855

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