Coating for silver plated circuits
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United States of America Patent
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Aug 10, 2004
Grant Date -
N/A
app pub date -
Apr 14, 2003
filing date -
Apr 14, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion or electroless silver plate prior to soldering, after which immersion silver plate is treated with an alkaline polymer coating comprising aqueous vinyl polymers, aqueous acrylic polymers, anti-fungal agents and a benzotriazole or benzimidazole compound to produce a deposit that is resistant to electromigration and that provides an anti-tarnish and anti-corrosion coating on the surface.
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