LED devices and silicone resin composition therefor
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United States of America Patent
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Sep 29, 2009
Grant Date -
Sep 29, 2005
app pub date -
May 26, 2005
filing date -
Nov 29, 2002
priority date (Note) -
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Abstract
LED devices encapsulated with silicone resin compositions comprising (A) a silicone resin having at least two alkenyl groups bonded to silicon atoms in a molecule, (B) an organohydrogensilane and/or organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicon atoms in a molecule, and (C) an addition reaction catalyst which cure into transparent products having heat resistance and discoloration resistance.
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