Metalization repair in semiconductor wafers

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11171063
APP PUB NO 20180096902A1
SERIAL NO

15440017

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Abstract

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Embodiments are directed to a method for repairing features of a host semiconductor wafer. The method includes forming a feature of the host semiconductor wafer, wherein the feature includes a first conductive material and a surface having a planar region and non-planar regions. The method further includes forming a metal conductive liner over the non-planar regions. The method further includes applying a second conductive material metal layer over said the conductive liner. The method further includes recessing the second conductive material to be substantially planar with the planar region.

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Patent Owner(s)

  • IBM CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Clevenger, Lawrence A LaGrangeville, US 714 4453
Li, Baozhen South Burlington, US 176 791
Peterson, Kirk D Jericho, US 152 1142
Sheets,, II John E Zumbrota, US 133 570

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