Semiconductor structures and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11961811
APP PUB NO 20220310542A1
SERIAL NO

17839494

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Abstract

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A semiconductor structure includes a semiconductor element and a first bonding structure. The semiconductor element has a first surface and a second surface opposite to the first surface. The first bonding structure is disposed adjacent to the first surface of the semiconductor element, and includes a first electrical connector, a first insulation layer surrounding the first electrical connector and a first conductive layer surrounding the first insulation layer.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Tsao-Lun Hsinchu, TW 5 25
Kuo, Hung-Jui Hsinchu, TW 370 1600
Tsai, Hui-Jung Hsinchu, TW 80 200
Yu, Chen-Hua Hsinchu, TW 2036 41015

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