Primer composition

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United States of America Patent

PATENT NO 9057132
APP PUB NO 20140343193A1
SERIAL NO

14361485

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed herein is a primer composition capable of forming a primer layer excellent in adhesion properties and film-forming properties on the surfaces of various materials that may be bonded with an epoxy-based adhesive. The primer composition includes: an epoxy resin containing at least a bisphenol A-type epoxy resin and a phenol novolac-type epoxy resin; a curing agent being dicyandiamide; a curing catalyst being imidazole; and an inorganic oxide filler containing fumed silica, at least a surface of which is hydrophobic and which has a primary particle diameter of 7 to 40 nm and a specific surface area of 50 to 380 m2/g, in an amount of 0.5 to 3 parts by weight per 100 parts by weight of the total amount of the epoxy resins, wherein the primer composition includes no solvent.

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Patent Owner(s)

  • SUMITOMO METAL MINING CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miyauchi, Kyouko Ichikawa, JP 2 0
Takita, Yuka Ichikawa, JP 2 0
Yamabe, Hidetoshi Ichikawa, JP 15 45

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