Printed circuit board stack structure and manufacturing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11910535
APP PUB NO 20230240014A1
SERIAL NO

17685404

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A printed circuit board stack structure includes a first printed circuit board, a second printed circuit board, and a filling glue layer. The first printed circuit board has at least one overflow groove, and includes first pads and a retaining wall surrounding the first pads. The second printed circuit board is disposed on the first printed circuit board, and includes second pads and conductive pillars located on some of the second pads. The conductive pillars are respectively connected to some of the first pads to electrically connect the second printed circuit board to the first printed circuit board. The filling glue layer fills between the first and the second printed circuit boards, and covers the first pads, the second pads, and the conductive pillars. The retaining wall blocks the filling glue layer so that a portion of the filling glue layer is accommodated in the overflow groove.

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First Claim

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Patent Owner(s)

  • UNIMICRON TECHNOLOGY CORP.

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Shih-Lian New Taipei, TW 30 56
Wu, Ming-Hao Taoyuan, TW 27 58

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