Anhydride polymers for use as curing agents in epoxy resin-based underfill material
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United States of America Patent
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Apr 10, 2007
Grant Date -
Jul 13, 2006
app pub date -
Mar 8, 2006
filing date -
Dec 21, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
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