Process of producing copper-alloy and copper alloy plate used for making electrical or electronic parts
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United States of America Patent
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Aug 21, 1984
Grant Date -
N/A
app pub date -
Sep 22, 1983
filing date -
Oct 20, 1982
priority date (Note) -
Expired
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Abstract
This invention provides an economic copper-nickel alloy having high strength and high conductivity for lead conductor materials and/or lead frames for transistors, integrated circuits, and the like. The copper alloy comprises a composite of copper and inexpensive elements comprising 3.0% by weight nickel; from 0.01 to 1.0% by weight silicon; and from 0.01 to 0.1% by weight phosphorus. In one preferred embodiment a specific weight % of iron is also added. Still further, an improved method is provided for fabricating the alloy according to a specific series and sequence of steps, including steps at specific conditions and for specific times, for providing precipitation hardening. Other advantageous properties comprise desirable elongation.
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