Multilayer printed circuit board with placebo vias for controlling interconnect skew
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 26, 2002
Grant Date -
N/A
app pub date -
Mar 14, 2000
filing date -
Mar 14, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multi-layer printed circuit board that includes a first layer and a second layer that have first and second signal traces, respectively. The multi-layer printed circuit board includes a via that couples a signal transmitting component to the second signal trace and a throttling member, which is coupled to the first signal trace. The throttling member reduces the speed at which a first signal routed over the first signal trace travels when compared to the speed at which that signal would have traveled had the throttling member been absent.
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