Importance

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Abstract

It is an object of the present invention to provide a vertical heat treatment apparatus having a heat insulator, which has sufficient heat insulation, heat retention and high load pressure bearing properties to cope with increased size dimensions and number of layers of wafer workpieces and can be particularly advantageously used as a semiconductor and TFT substrate heat treatment apparatus. The apparatus features the use of a heat insulator casing 40 supporting a substrate holder 3 on its top and receiving a heat insulator 50 having numerous inner microspaces in its lower space, and defining a substrate holder or boat insulator receiving space A and a heat insulator receiving space B such that these spaces are hermetically sealed with respect to each other by the heat insulator casing. It is also a feature of the apparatus that the heat insulator receiving space B is in communication with the exterior or that the pressure in the heat insulator receiving space B can be reduced or increased through a contact section of a closure member 70 which supports the heat insulator casing 40 or a heat insulator casing flange 41.

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First Claim