Importance

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Abstract

A soldering apparatus of the reflow type contains a preheating chamber and a reflow chamber which are provided with a plurality of heaters for heating printed circuit boards with chips temporarily mounted thereon with solder pastes during conveyance by a conveyor. The heaters are provided with a screening member and/or a partition member so as to prevent direct radiation of radiant heat from the heaters into the chambers and onto the printed circuit boards and to provide a uniform air flow to be blown uniformly onto the printed circuit boards. The heaters are arranged so as to heat them in such a manner as to increase temperatures in the direction from an inlet to an outlet so as to become higher with a predetermined temperature differential from the previous heater, thus removing bubbles generated upon fusion of the solder pastes and minimizing heat shock to the chips as they are heated. The preheating chamber is further provided with a combustion unit with a catalyst for removing fume and odorous gases generated in the chamber and for circulating the heated air after removal of such fume and gases. These arrangements can provide printed circuit boards of higher quality and with high productivity.

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First Claim