Universal interposer for a semiconductor package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11901300
APP PUB NO 20230268280A1
SERIAL NO

17677899

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A universal interposer for an integrated circuit (IC) device has a body having a first surface and a second surface opposite the first surface. A first region is formed on a first side of the body along a first edge. The first region has first slots, each having an identical first bond pad layout. A second region is formed on the first side along a second edge, opposite the first edge. The second region has second slots having an identical second bond pad layout. A third region having third slots is formed on the first side between the first and second regions, each slot having an identical third bond pad layout. A pad density of the third bond pad layout is greater than the first bond pad layout. One of the third slots is coupled to contact pads disposed in a region not directly below any of the second slots.

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Patent Owner(s)

  • XILINX INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gaide, Brian C Erie, US 55 418
Gandhi, Jaspreet Singh San Jose, US 26 111

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