Electrical interconnect contact system
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United States of America Patent
Stats
-
Dec 3, 1991
Grant Date -
N/A
app pub date -
Jan 9, 1991
filing date -
Jan 9, 1991
priority date (Note) -
Expired
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Abstract
An electrical interconnect assembly for interconnecting a lead of an integrated circuit device to a terminal spaced at a distance from a corresponding lead of the integrated circuit. The assembly includes a housing which is, typically, positioned between the lead of the integrated circuit and the corresponding terminal. The housing includes at least one slot which extends through the thickness thereof. Each of first and second opposed surfaces of the housing has formed therein a trough which is positioned at a location proximate the integrated circuit lead and the spaced terminal corresponding to the integrated circuit lead, respectively. A rigid first element is received in the trough formed in the first surface, and the rigid element extends across any slots in which one or more contacts are received. A generally planar contact is received within each of the one or more of the slots. Each contact has a protrusion extending outward from the first surface of the housing to be engaged by an integrated circuit lead, and, similarly, each contact has a nub normally extending outward from the housing toward the second surface of the housing to engage a corresponding spaced terminal. Each contact has a hook portion proximate the nub of the contact. The hook portion encircles an elastomeric second element received in the trough formed in the second surface of the housing. Each contact has an elongated channel to receive the rigid first element formed therein, the channel receiving the rigid first element for relative movement along the channel.
First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- JOHNSON, DAVID A.
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Johnson, David A | 5600 W. 251/2 St., St. Louis Park, MN 55416 | 250 | 4060 |
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Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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