Wiring substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11464104
APP PUB NO 20210014960A1
SERIAL NO

16981312

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A wiring substrate comprises a first substrate, a second substrate which includes a frame body located on the outer circumferential edge of the first substrate, at least two connecting parts connected to the inner circumferential part of the frame body, and a support body connecting the two connecting parts to each other, and a third substrate located on a surface of the second substrate opposite the first substrate. The support body includes a direction changing part between the two connecting parts and does not include an annular structure where the direction changing part is included on the circumference.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • KYOCERA CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sakurai, Keizou Yasu, JP 14 60

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Apr 4, 2026
7.5 Year Payment $3600.00 $1800.00 $900.00 Apr 4, 2030
11.5 Year Payment $7400.00 $3700.00 $1850.00 Apr 4, 2034
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00