Method for measuring film thickness distribution of wafer with thin films

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11965730
APP PUB NO 20220341728A1
SERIAL NO

17762859

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method includes: determining height Z1 of a focus by an optical microscope having autofocus function which uses irradiation light of wavelength λ0 to adjust the focus; determining a wavelength λ1 of irradiation light used for obtaining observation image of second thin film; obtaining observation image of second thin film by using irradiation light of the wavelength λ1, while altering heights of the focus with the Z1 as reference point; calculating standard deviation of reflected-light intensity distribution within the observation image, obtaining height Z2 of the focus corresponding to a peak position where standard deviation is greatest, and calculating a difference ΔZ between Z1 and Z2; correcting the autofocus function with ΔZ as a correction value; and using the corrected autofocus function to adjust the focus, obtaining the observation image of the second thin film, and calculating the film thickness distribution from the reflected-light intensity distribution within the observation image.

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Patent Owner(s)

  • SHIN-ETSU HANDOTAI CO LTD.; UNITY SEMICONDUCTOR

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gastaldo, Philippe Pontcharra, FR 18 69
Kuwabara, Susumu Annaka, JP 14 145
Quinquinet, Kevin Villard Bonnot, FR 1 0

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