Different materials bonded member and production method thereof
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United States of America Patent
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Jul 20, 2010
Grant Date -
Sep 25, 2008
app pub date -
Apr 17, 2008
filing date -
Dec 26, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.
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