Semiconductor device having die attachment and die pad for applying tensile or compressive stress to the IC chip
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 3, 2007
Grant Date -
Dec 7, 2006
app pub date -
May 25, 2006
filing date -
Nov 21, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
A semiconductor device comprises a substrate, a ferroelectric capacitor which includes a ferroelectric film on the substrate, and a stress application layer which applies tensile or compressive stress to the ferroelectric film of the ferroelectric capacitor by applying stress to the substrate.
Loading the Abstract Image...
OK
First Claim
Family
Loading Family data...
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully