Method and arrangement for drying substrates after treatment in a liquid
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United States of America Patent
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-
Oct 31, 2000
Issued Date -
N/A
app pub date -
Jul 30, 1998
filing date -
Feb 27, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and an arrangement is provided for treating substrates, such as, for example, silicon wafers (1), in which the latter are immersed for some time in a bath (2) containing a liquid (1) and are then taken therefrom so slowly that practically the whole quantity of liquid remains in the bath (2). According to the invention, the substrates (1) are brought from the liquid (3) directly into contact with a vapor not condensing thereon via leads (17) with outlet nozzles (18). The vapor is of a substance miscible with the liquid (3), which, when mixed therewith, yields a mixture having a surface tension lower than that of the liquid. It has been found that no drying marks with organic or metallic residues or other contaminations then remain on the substrates (1).
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