Array substrate and display device with interposer bonded to drive circuit and manufacturing method thereof

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United States of America Patent

PATENT NO 11502153
APP PUB NO 20210217837A1
SERIAL NO

16761823

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Abstract

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An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line embedded in the other side of the interposer substrate. The bonding connection line is configured to be connected to a drive circuit. An interposer via hole is arranged on the interposer substrate. A conductive structure is arranged in the interposer via hole. The thin-film transistor is electrically connected to the bonding connection line by the conductive structure.

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Patent Owner(s)

  • BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Di, Muxin Beijing, CN 29 21
Gu, Renquan Beijing, CN 37 12
Li, Wusheng Beijing, CN 35 43
Liang, Zhiwei Beijing, CN 55 55
Liu, Yingwei Beijing, CN 56 64
Ryu, Jaiil Beijing, CN 7 2
Yao, Qi Beijing, CN 229 765

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