Method and apparatus of interleaving memory bank in multi-layer bus system

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United States of America Patent

PATENT NO 7373453
APP PUB NO 20050182908A1
SERIAL NO

11052773

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Abstract

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A method and apparatus of interleaving memory banks in a multi-layer bus system. The apparatus includes a plurality of slave interface units receiving signals requesting a bus access and generating control signals, and a controller receiving the control signals generated from the plurality of slave interface units and generating signals required to access the memory banks. Accordingly, it is possible to greatly reduce a delay time caused when accessing a synchronous dynamic random access memory (SDRAM), for example, in a multi-layer bus system.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kang, Woo-seok Seoul, KR 8 20

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