Pad-temperature regulating apparatus, method of regulating pad-temperature, polishing apparatus, and polishing system

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United States of America

PATENT NO 11919124
SERIAL NO

17417294

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Abstract

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The present application relates to a pad-temperature regulating apparatus for regulating a temperature of a surface of a polishing pad. The pad-temperature regulating apparatus includes a pad-contact member, a supply system for supplying a heating liquid and a cooling liquid into the pad contact member, a pad-temperature measuring device for measuring the temperature of the surface of the polishing pad, and a controller for performing a PID control of manipulated variables of a first flow control valve and a second flow control valve. The controller includes a memory in which a learned model constructed to maintain a temperature behavior curve, created based on measured values of the pad-temperature measuring device, within a predetermined allowable range, is stored; and a processing device which inputs at least one temperature behavior parameter to the learned model, and performs a calculation to output a change value of PID parameter for the PID control.

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Patent Owner(s)

  • EBARA CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Maruyama, Toru Tokyo, JP 90 708

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