Semiconductor device package with integrated heat spreader
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United States of America Patent
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Sep 27, 2011
Grant Date -
May 3, 2007
app pub date -
Nov 1, 2006
filing date -
Nov 2, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A multi chip housing has a lead frame to which plural die are soldered. A heat spreader conductive cap encloses a volume containing the plural die or chips and is fixed to the periphery of the lead frame. The tops of the die are closely spaced from the interior of the cap and the volume is filled with a thermally conductive, electrically insulating plastic encapsulant.
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