High-frequency circuit components
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United States of America Patent
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Apr 12, 2011
Grant Date -
Apr 2, 2009
app pub date -
Dec 2, 2008
filing date -
Jun 3, 2006
priority date (Note) -
In Force
status (Latency Note)
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Abstract
High-frequency circuit components are disclosed in which parasitic capacitance between a high-frequency circuit element and a substrate is reduced and mechanical strength is improved. An exemplary component has a conductive substrate, a coil as the high-frequency circuit-element, a mounting board including a thin dielectric film on which the coil is mounted, and a support board that couples the mounting board to the substrate. The mounting board is coupled so that it floats relative to the substrate as a result of deliberate warping of the support board.
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