Wafer edge scrubber and method
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United States of America Patent
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-
Oct 9, 2001
Grant Date -
N/A
app pub date -
Jul 10, 1998
filing date -
Jul 10, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An inventive brush and scrubbing device is provided for simultaneously scrubbing both planar and profiled (e.g., edge) surfaces of a thin disk such as a semiconductor wafer. The inventive brush has a contact surface having two portions, a planar portion for contacting a planar surface of a wafer, and a profiled portion for contacting an edge surface of a wafer. The profile of the profiled portion preferably follows the edge profile of a wafer to be cleaned by the brush. The profiled portion may have a higher modulus of elasticity than does the planar portion. Preferably the brushes are roller type PVA brushes having a plurality of nodules formed thereon.
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Cited Art Landscape
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