Method for producing mounting structure for an electronic component
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United States of America Patent
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Jun 15, 2004
Grant Date -
Nov 6, 2003
app pub date -
Apr 7, 2003
filing date -
Mar 10, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
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