Integrated circuit package system with leads separated from a die paddle

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8278148
APP PUB NO 20090072364A1
SERIAL NO

11854989

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Importance

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Abstract

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An integrated circuit package system is provided including forming a leadframe having a frame and a die paddle having leads thereon. The leads are held with respect to the die paddle. The leads are separated from the die paddle, and a die is attached to the die paddle. Bond wires are bonded between the leads and the die. The die and bond wires are encapsulated. The leadframe is singulated to separate the frame and the die paddle.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTE.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Camacho, Zigmund Ramirez Singapore, SG 173 1461
Pisigan, Jairus Legaspi Singapore, SG 32 289
Punzalan, Jeffrey D Singapore, SG 70 852
Tay, Lionel Chien Hui Singapore, SG 116 1739

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